Thermal Management and Performance Validation of a High Temperature Downhole Monitoring System for Smart Well Applications

Yan Zheng; Long Wang; Zhiqiang Dun; Junyu Zhong

doi:10.54691/eqxs2196

Authors

Yan Zheng
Long Wang
Zhiqiang Dun
Junyu Zhong

DOI:

https://doi.org/10.54691/eqxs2196

Keywords:

Downhole Parameter Acquisition; Remote Monitoring; Thermal Design; Modbus Communication Protocol; Thermal Reliability Testing.

Abstract

To obtain environmental parameters of production zones during well completion operations, a high-temperature-resistant downhole multi-parameter monitoring system was designed. By enabling remote monitoring of downhole environmental parameters, the system provides a basis for formulating efficient extraction strategies. To address the challenge of electronic equipment failure under high temperatures, the heat transfer mechanism of circuits within the hermetically sealed environment of downhole electrically controlled flow control valves was analyzed. A thermal simulation model of downhole circuits was established, and thermal analysis of downhole acquisition circuits was conducted using specialized simulation software. Through optimized chip layout and heat dissipation design, the system's heat resistance was significantly improved. For communication, the Modbus protocol was selected, and a surface control system was developed using the ForceControl platform. This achieved real-time communication between surface control equipment and downhole acquisition circuits. Multi-node communication tests and high-temperature experiments verified that the monitoring system operates stably at 120°C, with accurate and reliable data transmission among multiple nodes, meeting actual engineering requirements. This system offers a reliable solution for the design of intelligent downhole multi-parameter monitoring systems.

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